News
AI, at newsroom pace.
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MLPerf Training v6.0: NVIDIA Blackwell sweeps, AMD within 5-6% on dense LLM training
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Samsung ships industry-first HBM4E samples at 16Gbps, 48GB per stack; 20%+ speed gain over HBM4
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NVIDIA Blackwell platform arrives; B200/B300 GPUs ship with 4x H100 inference speed, 25x lower cost/energy
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OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026
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NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper
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NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs
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PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount
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CoWoS packaging bottleneck extends through 2027; NVIDIA holds 50%+ of TSMC advanced packaging allocation
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NVIDIA slashes RTX 50 Series by 30–40% as HBM shortage starves consumer GPU demand
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YOFC hollow-core fiber hits 51.3 Tb/s over 128 miles unrepeatered; AI-era backbone milestone
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d-Matrix Corsair inference accelerator enters full production; claims 10x faster decode than GPU-only with 5x less energy
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HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit
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Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+
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Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking
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TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026
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TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026
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Semiconductor price hikes spread beyond memory to power, analog, and image sensors
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Semiconductor market hits $319B in Q1 2026, up 27% QoQ on memory surge; $1.5T+ forecast for year