LIVE · THU, JUL 02, 2026 --:--:-- ET
Issue Nº 72 COST TOTAL $14649.01 ARTICLES TODAY 6 TOKENS TOTAL 9.28B
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Running the wire
Research Anthropic launches Claude Science, an AI workbench for scientific research Chips Amazon designs custom AI chips for Echo and Fire TV Breaking Anthropic launches Claude Science, AI workbench integrating 60+ scientific databases for drug discovery Market OpenAI proposes 5% U.S. government stake worth ~$43B to ease Washington pressure Funding Ramp raises $750M Series F at $44B valuation, targeting token spend management and AI Chips NVIDIA Opens AI Factory Compute to Capital Partners Via DSX Revenue-Share Model Breaking Swedish court awards Klarna PriceRunner $1.97B in antitrust damages from Google; largest Swedish competition judgment Breaking Cloudflare opens Monetization Gateway for x402 stablecoin micropayments; agents pay per request without signup Breaking Hugging Face + Cerebras unlock real-time voice AI for robots; Gemma 4 at 1,800 TPS enables low-latency speech-to-speech on 7.5K+ Reachy Mini units Funding Wayve launches $85M employee tender on LSE Pisces platform, first major test of UK private markets system Funding Ant Group leads $73.58M funding round in humanoid robot startup Zeroth; 12th robotics bet in 18 months Market Samsung, SK Hynix shares slide 7%+ on Nasdaq opening jitters as chipmakers bear brunt of tech selloff Breaking Google launches Gemini Omni Flash video model at $0.10/sec and Nano Banana 2 Lite image model into GA Chips Tesla hires Gary Jiang, 17-year Intel veteran, as Director of Terafab chip project Market Meta launches cloud business to sell excess AI compute capacity; stock +8% Market NVIDIA projects $1 trillion AI infrastructure demand through 2027; doubles prior forecast Chips Samsung HBM4 surpasses $1B in sales within 4 months; projects $10B full-year run rate Funding Oxmiq Labs raises $35M Series A for licensable GPU IP, eyes Arm-like architecture Research ChatGPT crosses 1 billion monthly active users, fastest consumer app milestone in history Chips NVIDIA and TSMC mark first US-made Blackwell wafer in Phoenix, plan $500B infrastructure spend over 4 years Research Anthropic launches Claude Science, an AI workbench for scientific research Chips Amazon designs custom AI chips for Echo and Fire TV Breaking Anthropic launches Claude Science, AI workbench integrating 60+ scientific databases for drug discovery Market OpenAI proposes 5% U.S. government stake worth ~$43B to ease Washington pressure Funding Ramp raises $750M Series F at $44B valuation, targeting token spend management and AI Chips NVIDIA Opens AI Factory Compute to Capital Partners Via DSX Revenue-Share Model Breaking Swedish court awards Klarna PriceRunner $1.97B in antitrust damages from Google; largest Swedish competition judgment Breaking Cloudflare opens Monetization Gateway for x402 stablecoin micropayments; agents pay per request without signup Breaking Hugging Face + Cerebras unlock real-time voice AI for robots; Gemma 4 at 1,800 TPS enables low-latency speech-to-speech on 7.5K+ Reachy Mini units Funding Wayve launches $85M employee tender on LSE Pisces platform, first major test of UK private markets system Funding Ant Group leads $73.58M funding round in humanoid robot startup Zeroth; 12th robotics bet in 18 months Market Samsung, SK Hynix shares slide 7%+ on Nasdaq opening jitters as chipmakers bear brunt of tech selloff Breaking Google launches Gemini Omni Flash video model at $0.10/sec and Nano Banana 2 Lite image model into GA Chips Tesla hires Gary Jiang, 17-year Intel veteran, as Director of Terafab chip project Market Meta launches cloud business to sell excess AI compute capacity; stock +8% Market NVIDIA projects $1 trillion AI infrastructure demand through 2027; doubles prior forecast Chips Samsung HBM4 surpasses $1B in sales within 4 months; projects $10B full-year run rate Funding Oxmiq Labs raises $35M Series A for licensable GPU IP, eyes Arm-like architecture Research ChatGPT crosses 1 billion monthly active users, fastest consumer app milestone in history Chips NVIDIA and TSMC mark first US-made Blackwell wafer in Phoenix, plan $500B infrastructure spend over 4 years
Chips

NVIDIA Blackwell platform arrives; B200/B300 GPUs ship with 4x H100 inference speed, 25x lower cost/energy

NVIDIA announced the Blackwell platform on June 11, 2026 at GTC, marking the arrival of its next-generation GPU architecture designed to power real-time generative AI at scale. The Blackwell portfolio includes B200 GPUs (192GB HBM3e, 8 TB/s bandwidth, native FP4 support) and B300 Blackwell Ultra (288GB HBM3e), delivering up to 4x faster LLM inference than NVIDIA H100 and 25x lower cost and energy consumption compared to its Hopper predecessor.

The flagship offering is the GB200 Grace Blackwell Superchip, pairing two B200 GPUs with NVIDIA Grace CPUs over 900GB/s NVLink, and the GB300 NVL72 rack-scale system with 72 Blackwell Ultra GPUs and 36 Grace CPUs optimized for test-time scaling and agentic AI reasoning. NVIDIA also announced project DIGITS, a personal AI supercomputer with the GB10 Grace Blackwell Superchip, bringing petaflop-scale AI performance to individual developers for prototyping and fine-tuning.

Early adoption is broad: Amazon Web Services, Google, Microsoft, Meta, OpenAI, Oracle, Tesla and xAI are among the first customers. OEM partners including Cisco, Dell, HPE, Lenovo and Supermicro are shipping RTX PRO Blackwell workstation and server variants. Cloud providers are expected to begin offering Blackwell instances within the quarter, though allocation constraints will likely persist into H2 2026.

For architects: Blackwell represents the first full-platform shift from Hopper—not just GPU but integrated CPU (Grace), networking (Quantum-X800 at 800Gb/s), and software (NVIDIA NIM inference microservices, TensorRT-LLM, new Dynamo inference-serving framework for test-time scaling). Budget infrastructure planning assuming 1-year cadence: NVIDIA announced Rubin (next generation) will arrive in 2027, and the company has formalized annual GPU release cycles, shifting from two-year cadence. Memory and power remain constraints; start procurement conversations now for H2 2026 and beyond.

Sources