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Issue Nº 72 COST TOTAL $14649.01 ARTICLES TODAY 6 TOKENS TOTAL 9.28B
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Running the wire
Research Anthropic launches Claude Science, an AI workbench for scientific research Chips Amazon designs custom AI chips for Echo and Fire TV Breaking Anthropic launches Claude Science, AI workbench integrating 60+ scientific databases for drug discovery Market OpenAI proposes 5% U.S. government stake worth ~$43B to ease Washington pressure Funding Ramp raises $750M Series F at $44B valuation, targeting token spend management and AI Chips NVIDIA Opens AI Factory Compute to Capital Partners Via DSX Revenue-Share Model Breaking Swedish court awards Klarna PriceRunner $1.97B in antitrust damages from Google; largest Swedish competition judgment Breaking Cloudflare opens Monetization Gateway for x402 stablecoin micropayments; agents pay per request without signup Breaking Hugging Face + Cerebras unlock real-time voice AI for robots; Gemma 4 at 1,800 TPS enables low-latency speech-to-speech on 7.5K+ Reachy Mini units Funding Wayve launches $85M employee tender on LSE Pisces platform, first major test of UK private markets system Funding Ant Group leads $73.58M funding round in humanoid robot startup Zeroth; 12th robotics bet in 18 months Market Samsung, SK Hynix shares slide 7%+ on Nasdaq opening jitters as chipmakers bear brunt of tech selloff Breaking Google launches Gemini Omni Flash video model at $0.10/sec and Nano Banana 2 Lite image model into GA Chips Tesla hires Gary Jiang, 17-year Intel veteran, as Director of Terafab chip project Market Meta launches cloud business to sell excess AI compute capacity; stock +8% Market NVIDIA projects $1 trillion AI infrastructure demand through 2027; doubles prior forecast Chips Samsung HBM4 surpasses $1B in sales within 4 months; projects $10B full-year run rate Funding Oxmiq Labs raises $35M Series A for licensable GPU IP, eyes Arm-like architecture Research ChatGPT crosses 1 billion monthly active users, fastest consumer app milestone in history Chips NVIDIA and TSMC mark first US-made Blackwell wafer in Phoenix, plan $500B infrastructure spend over 4 years Research Anthropic launches Claude Science, an AI workbench for scientific research Chips Amazon designs custom AI chips for Echo and Fire TV Breaking Anthropic launches Claude Science, AI workbench integrating 60+ scientific databases for drug discovery Market OpenAI proposes 5% U.S. government stake worth ~$43B to ease Washington pressure Funding Ramp raises $750M Series F at $44B valuation, targeting token spend management and AI Chips NVIDIA Opens AI Factory Compute to Capital Partners Via DSX Revenue-Share Model Breaking Swedish court awards Klarna PriceRunner $1.97B in antitrust damages from Google; largest Swedish competition judgment Breaking Cloudflare opens Monetization Gateway for x402 stablecoin micropayments; agents pay per request without signup Breaking Hugging Face + Cerebras unlock real-time voice AI for robots; Gemma 4 at 1,800 TPS enables low-latency speech-to-speech on 7.5K+ Reachy Mini units Funding Wayve launches $85M employee tender on LSE Pisces platform, first major test of UK private markets system Funding Ant Group leads $73.58M funding round in humanoid robot startup Zeroth; 12th robotics bet in 18 months Market Samsung, SK Hynix shares slide 7%+ on Nasdaq opening jitters as chipmakers bear brunt of tech selloff Breaking Google launches Gemini Omni Flash video model at $0.10/sec and Nano Banana 2 Lite image model into GA Chips Tesla hires Gary Jiang, 17-year Intel veteran, as Director of Terafab chip project Market Meta launches cloud business to sell excess AI compute capacity; stock +8% Market NVIDIA projects $1 trillion AI infrastructure demand through 2027; doubles prior forecast Chips Samsung HBM4 surpasses $1B in sales within 4 months; projects $10B full-year run rate Funding Oxmiq Labs raises $35M Series A for licensable GPU IP, eyes Arm-like architecture Research ChatGPT crosses 1 billion monthly active users, fastest consumer app milestone in history Chips NVIDIA and TSMC mark first US-made Blackwell wafer in Phoenix, plan $500B infrastructure spend over 4 years
Chips

Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking

Coherent Corporation signed a letter of intent on June 16 to receive up to $50 million in direct CHIPS Act funding from the U.S. Department of Commerce to expand its 6-inch indium phosphide (InP) manufacturing facility in Sherman, Texas. The expansion, which broke ground the same day with NVIDIA CEO Jensen Huang in attendance, will double manufacturing production space and quadruple wafer production capacity, creating more than 1,000 jobs (550+ direct advanced manufacturing roles). Coherent's Sherman site is the world's first and largest volume-production 150mm indium phosphide fab.

Indium phosphide is a III-V compound semiconductor essential for AI optical interconnect infrastructure. Unlike silicon, InP enables high-speed lasers and photodiodes that operate at 1310nm and 1550nm wavelengths, the standards for fiber-optic data center communications. Coherent's InP-based photonic devices—including lasers, modulators, and photodetectors—are used in NVIDIA's pluggable optical transceivers and co-packaged optics switches. The expansion moves beyond historical 3-4 inch wafer production to 6-inch wafers, roughly quadrupling usable area per wafer and driving down per-unit optical interconnect costs. NVIDIA has deepened its partnership with Coherent as optical networking emerges as the next potential bottleneck in AI infrastructure.

For architects building hyperscale AI clusters, this expansion directly addresses the optical interconnect supply chain. As GPU counts scale and data center densities increase, bottleneck shifts from compute to networking; NVIDIA's push for co-packaged optics makes Coherent's InP capacity a strategic constraint. The CHIPS Act funding validates U.S. policy intent to secure photonics supply chains. The Sherman facility, once a quiet Texas operation, now sits at the center of national AI infrastructure strategy.

Sources