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Everything the newsroom published, in chronological order. Each item carries origin, sources and reading time.

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Mon, Jun 29

27 stories
CHIPS Samsung ships industry-first HBM4E samples at 16Gbps, 48GB per stack; 20%+ speed gain over HBM4 news.samsung.com· 55 days ago MARKET Micron guides $50B Q4 revenue, 86% margins; signs 16 strategic customer agreements worth ~$100B investors.micron.com· 55 days ago CHIPS d-Matrix Corsair inference accelerator enters full production; claims 10x faster decode than GPU-only with 5x less energy prnewswire.com· 55 days ago MARKET SoftBank commits €75 billion to build 5 GW of AI data center capacity across France through 2031 datacenterknowledge.com· 55 days ago FUNDING UK government backs £400 million venture capital initiative for diverse fund managers sifted.eu· 55 days ago COMPUTE Google's Paper Assistant Reviews 10,000 Scientific Papers in 30 Minutes ai|expert Scout· 55 days ago· 11 sources CHIPS NVIDIA Blackwell platform arrives; B200/B300 GPUs ship with 4x H100 inference speed, 25x lower cost/energy nvidianews.nvidia.com· 55 days ago BREAKING HP deploys OpenAI Frontier across enterprise operations; joins six inaugural platform adopters hp.com· 55 days ago MARKET 79% of global AI data center capacity faces elevated climate hazard risk; operators shift to rural, extreme-weather zones cnbc.com· 55 days ago FUNDING Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations cnbc.com· 55 days ago FUNDING Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D investing.com· 55 days ago CHIPS HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit siliconanalysts.com· 55 days ago MARKET Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 distillintelligence.com· 55 days ago CHIPS OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 windowsforum.com· 55 days ago MARKET TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 techtimes.com· 55 days ago RESEARCH DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI techtimes.com· 55 days ago BREAKING OpenAI launches $150M Partner Network to certify 300K consultants by year-end explainx.ai· 55 days ago RESEARCH AI Agents Double Repository-Level Merge Friction ai|expert Scout· 55 days ago· 6 sources BREAKING HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships openai.com· 55 days ago BREAKING Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes easternherald.com· 55 days ago FUNDING Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand cnbc.com· 55 days ago BREAKING Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks datacenterknowledge.com· 55 days ago CHIPS Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ metaintro.com· 55 days ago CHIPS NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper vrlatech.com· 55 days ago POLICY FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs ferc.gov· 55 days ago CHIPS Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking coherent.com· 55 days ago CHIPS NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs nvidianews.nvidia.com· 55 days ago

Sun, Jun 28

13 stories
CHIPS TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 semiengineering.com· 55 days ago CHIPS PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount tomshardware.com· 55 days ago CHIPS TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026 markets.financialcontent.com· 55 days ago CHIPS CoWoS packaging bottleneck extends through 2027; NVIDIA holds 50%+ of TSMC advanced packaging allocation siliconanalysts.com· 55 days ago FUNDING Anthropic scales to 1M+ Google TPUs, adds 3.5GW via Broadcom partnership; revenue run rate hits $30B anthropic.com· 55 days ago MARKET CoreWeave joins Nasdaq-100 just 15 months post-IPO; GPU cloud provider valued at $64B+ with $56B revenue backlog coreweave.com· 55 days ago FUNDING ON Semiconductor acquires Synaptics for $7B, betting big on edge AI and robotics tekedia.com· 55 days ago CHIPS Semiconductor price hikes spread beyond memory to power, analog, and image sensors semicone.com· 55 days ago CHIPS NVIDIA slashes RTX 50 Series by 30–40% as HBM shortage starves consumer GPU demand gpunex.com· 55 days ago FUNDING AI infrastructure funding hits $12.5B in 12 months, but concentrated: top 10 deals = 82.7% of capital newmarketpitch.com· 55 days ago CHIPS Semiconductor market hits $319B in Q1 2026, up 27% QoQ on memory surge; $1.5T+ forecast for year omdia.tech.informa.com· 55 days ago CHIPS NVIDIA, SK Hynix form multiyear partnership on next-gen memory for AI factories originbrief.app· 55 days ago MARKET Google, Blackstone form $5B TPU cloud venture; 500 MW online 2027 as Alphabet challenges Nvidia dominance blackstone.com· 55 days ago