Google has reportedly contracted Intel for packaging and assembly of more than 3 million custom TPUs in 2028, leveraging Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology alongside SK hynix HBM integration.
The deal underscores the scale of AI silicon demand and Intel's pivot toward foundry services; EMIB packaging addresses the memory-bandwidth bottleneck critical for AI workloads, extending Intel's relevance in the AI accelerator supply chain beyond process node competition.