<cite index="62-2">Eliyan Corporation has completed its Series C with a total of $145 million at a $1 billion valuation. The oversubscribed round was led by Seligman Ventures, with participation from additional new and existing investors, including two new strategic investors: Cisco Investments and Lumentum</cite>. <cite index="62-2">As part of the financing, veteran technology investor and operator Umesh Padval, Managing Partner of Seligman Ventures, will join Eliyan's Board of Directors</cite>.
<cite index="62-3">Eliyan's Die-to-Die, Chip-to-Chip, and Rack-to-Rack chiplet interconnect technologies are designed to address the increasingly complex connectivity demands of next-generation AI systems spanning advanced package-level integration, multi-package scale-up architectures, memory expansion, and emerging high-bandwidth infrastructure fabrics</cite>. <cite index="66-2">Its chiplet technology solves the AI data center bottleneck that leaves GPU utilization stuck at 30 to 40%</cite>.
<cite index="64-2">Demand for AI infrastructure surges and chipmakers search for ways to eliminate one of the industry's biggest performance constraints: moving data between processors quickly enough to keep increasingly powerful AI chips fully utilized</cite>. <cite index="67-4">Eliyan's NuLink PHYs and NuGear chiplets provide die-to-die, chip-to-chip and rack-to-rack connectivity that can drastically improve both the bandwidth capacity and power efficiency of AI clusters</cite>. <cite index="66-3">Eliyan expects revenue to grow from low millions in 2025 to hundreds of millions of dollars by end of 2027, with initial chiplet product shipments beginning in 2026</cite>.
For data-center architects and AI infrastructure planners: Eliyan addresses a critical constraint that has been largely invisible but is now limiting GPU utilization at scale—data movement between processors. Unlike NVIDIA's proprietary InfiniBand and NVLink ecosystems, <cite index="66-4">Eliyan positions itself as a vendor-agnostic independent alternative that semiconductor companies can integrate into their own chip designs</cite>. With Cisco, Lumentum, and a portfolio of 100+ patents, plus explicit commercial timelines (shipments beginning 2026, revenue guidance to hundreds of millions by end-2027), Eliyan signals that electro-optical interconnect is graduating from lab research to critical infrastructure in AI clusters.