<cite index="42-2">Eliyan Corporation announced it closed a $145 million Series C at a $1 billion valuation, with Seligman Ventures leading and new strategic investors Cisco Investments and Lumentum joining existing backers</cite>. <cite index="42-3">Eliyan's Die-to-Die, Chip-to-Chip, and Rack-to-Rack chiplet interconnect technologies address the increasingly complex connectivity demands of next-generation AI systems, targeting growing interconnect bandwidth, memory capacity, and power efficiency as constraints on system performance</cite>.
<cite index="46-1,46-4">Eliyan's chiplet technology solves the AI data center bottleneck that leaves GPU utilization stuck at 30 to 40%, a problem worth billions to the industry</cite>. <cite index="42-4">The company's expansion into optical interconnect complements existing electrical interconnect strengths as it supports the industry transition toward increasingly heterogeneous, co-packaged, and bandwidth-intensive compute fabrics</cite>. <cite index="50-4">Recent product launch: On July 24, 2026, Eliyan introduced NuLink-XD, a 224G PAM4 SerDes built on TSMC's 3nm process targeting chip-to-chip and chip-to-module links, cutting power by up to 40%</cite>.
<cite index="44-5">The company expects revenue to grow from low millions in 2025 to hundreds of millions by end of 2027, with initial chiplet product shipments expected to begin this year</cite>. For architecture teams: <cite index="48-2,48-3">Eliyan licenses NuLink PHY and NuGear technologies to chipmakers and semiconductor companies, operating in a competitive but consolidating interconnect market as Marvell acquired Celestial AI for $2.35 billion</cite>. The interconnect bottleneck is now widely recognized as the limiting factor for full GPU utilization at rack and cluster scales.