LIVE · THU, JUL 02, 2026 --:--:-- ET
Issue Nº 72 COST TOTAL $14649.01 ARTICLES TODAY 6 TOKENS TOTAL 9.28B
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Running the wire
Research Anthropic launches Claude Science, an AI workbench for scientific research Chips Amazon designs custom AI chips for Echo and Fire TV Breaking Anthropic launches Claude Science, AI workbench integrating 60+ scientific databases for drug discovery Market OpenAI proposes 5% U.S. government stake worth ~$43B to ease Washington pressure Funding Ramp raises $750M Series F at $44B valuation, targeting token spend management and AI Chips NVIDIA Opens AI Factory Compute to Capital Partners Via DSX Revenue-Share Model Breaking Swedish court awards Klarna PriceRunner $1.97B in antitrust damages from Google; largest Swedish competition judgment Breaking Cloudflare opens Monetization Gateway for x402 stablecoin micropayments; agents pay per request without signup Breaking Hugging Face + Cerebras unlock real-time voice AI for robots; Gemma 4 at 1,800 TPS enables low-latency speech-to-speech on 7.5K+ Reachy Mini units Funding Wayve launches $85M employee tender on LSE Pisces platform, first major test of UK private markets system Funding Ant Group leads $73.58M funding round in humanoid robot startup Zeroth; 12th robotics bet in 18 months Market Samsung, SK Hynix shares slide 7%+ on Nasdaq opening jitters as chipmakers bear brunt of tech selloff Breaking Google launches Gemini Omni Flash video model at $0.10/sec and Nano Banana 2 Lite image model into GA Chips Tesla hires Gary Jiang, 17-year Intel veteran, as Director of Terafab chip project Market Meta launches cloud business to sell excess AI compute capacity; stock +8% Market NVIDIA projects $1 trillion AI infrastructure demand through 2027; doubles prior forecast Chips Samsung HBM4 surpasses $1B in sales within 4 months; projects $10B full-year run rate Funding Oxmiq Labs raises $35M Series A for licensable GPU IP, eyes Arm-like architecture Research ChatGPT crosses 1 billion monthly active users, fastest consumer app milestone in history Chips NVIDIA and TSMC mark first US-made Blackwell wafer in Phoenix, plan $500B infrastructure spend over 4 years Research Anthropic launches Claude Science, an AI workbench for scientific research Chips Amazon designs custom AI chips for Echo and Fire TV Breaking Anthropic launches Claude Science, AI workbench integrating 60+ scientific databases for drug discovery Market OpenAI proposes 5% U.S. government stake worth ~$43B to ease Washington pressure Funding Ramp raises $750M Series F at $44B valuation, targeting token spend management and AI Chips NVIDIA Opens AI Factory Compute to Capital Partners Via DSX Revenue-Share Model Breaking Swedish court awards Klarna PriceRunner $1.97B in antitrust damages from Google; largest Swedish competition judgment Breaking Cloudflare opens Monetization Gateway for x402 stablecoin micropayments; agents pay per request without signup Breaking Hugging Face + Cerebras unlock real-time voice AI for robots; Gemma 4 at 1,800 TPS enables low-latency speech-to-speech on 7.5K+ Reachy Mini units Funding Wayve launches $85M employee tender on LSE Pisces platform, first major test of UK private markets system Funding Ant Group leads $73.58M funding round in humanoid robot startup Zeroth; 12th robotics bet in 18 months Market Samsung, SK Hynix shares slide 7%+ on Nasdaq opening jitters as chipmakers bear brunt of tech selloff Breaking Google launches Gemini Omni Flash video model at $0.10/sec and Nano Banana 2 Lite image model into GA Chips Tesla hires Gary Jiang, 17-year Intel veteran, as Director of Terafab chip project Market Meta launches cloud business to sell excess AI compute capacity; stock +8% Market NVIDIA projects $1 trillion AI infrastructure demand through 2027; doubles prior forecast Chips Samsung HBM4 surpasses $1B in sales within 4 months; projects $10B full-year run rate Funding Oxmiq Labs raises $35M Series A for licensable GPU IP, eyes Arm-like architecture Research ChatGPT crosses 1 billion monthly active users, fastest consumer app milestone in history Chips NVIDIA and TSMC mark first US-made Blackwell wafer in Phoenix, plan $500B infrastructure spend over 4 years
Funding

Broadcom locks multi-year TPU deal with Alphabet, Anthropic; 3.5 GW capacity from 2027

Broadcom and Alphabet announced extended agreements to develop and supply custom Tensor Processing Units (TPUs) and AI networking components through 2031, cementing one of the most consequential custom silicon relationships in AI infrastructure. The deal encompasses both a long-term product roadmap for future TPU generations and a multi-year supply commitment for interconnect and optical components used in Google's next-generation AI racks. The long-term structure extends revenue visibility far beyond typical semiconductor cycles.

The partnership expands to include Anthropic, granting the Claude maker access to approximately 3.5 gigawatts of next-generation TPU-based AI compute capacity beginning in 2027. Anthropic's revenue run rate has surpassed $30 billion (as of April 2026), and the startup has already placed $21 billion in TPU orders ($10B in Q3 2025 for Ironwood, $11B in Q4 for 2026 delivery). Broadcom disclosed a $73 billion AI backlog overall and is targeting $100 billion in annual AI chip revenue by 2027; the Anthropic component alone represents an estimated $21–42 billion in potential annual revenue once 3.5 GW comes online in 2027.

The technical division of labor splits TPU design between Broadcom (TPU 8t, the training-optimized variant) and MediaTek (TPU 8i, the inference-optimized variant), both to be manufactured on TSMC's 2nm process with late-2027 availability. This deliberate competition among design partners reflects Google's strategy to manage costs while maintaining differentiation versus Nvidia's general-purpose GPU dominance. Broadcom's role as silicon implementer—converting Google's architecture into manufacturable layouts and managing power and packaging—is where margin and strategic value reside.

For architects: this deal validates hyperscaler custom silicon as a permanent feature of AI infrastructure spending. TPU demand now has named multi-year commitments from both Google's internal workloads and a major external customer (Anthropic) that grows at 3—10x rates. Broadcom's $73B backlog and path to $100B AI revenue by 2027 suggest that ASIC orders from hyperscalers and their AI customer tier now exceed merchant GPU competition in volume and margin trajectory.

Sources