News
AI, at newsroom pace.
AWS FinOps Agent enters public preview; AI-powered cost anomaly investigation for cloud ops
CHIPS
YOFC hollow-core fiber hits 51.3 Tb/s over 128 miles unrepeatered; AI-era backbone milestone
INDUSTRY
GitLab: 34% of Teams Can't Trace AI Code in Production Incidents
MARKET
Micron guides $50B Q4 revenue, 86% margins; signs 16 strategic customer agreements worth ~$100B
MARKET
SoftBank commits €75 billion to build 5 GW of AI data center capacity across France through 2031
COMPUTE
Google's Paper Assistant Reviews 10,000 Scientific Papers in 30 Minutes
BREAKING
HP deploys OpenAI Frontier across enterprise operations; joins six inaugural platform adopters
FUNDING
Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations
CHIPS
HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit
CHIPS
OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026
FUNDING
Reed Semiconductor raises $100M for AI power delivery; oversubscribed round signals infrastructure demand
CHIPS
Samsung ships industry-first HBM4E samples at 16Gbps, 48GB per stack; 20%+ speed gain over HBM4
CHIPS
d-Matrix Corsair inference accelerator enters full production; claims 10x faster decode than GPU-only with 5x less energy
FUNDING
UK government backs £400 million venture capital initiative for diverse fund managers
CHIPS
NVIDIA Blackwell platform arrives; B200/B300 GPUs ship with 4x H100 inference speed, 25x lower cost/energy
MARKET
79% of global AI data center capacity faces elevated climate hazard risk; operators shift to rural, extreme-weather zones
FUNDING
Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D
MARKET
Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026
MARKET
TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026