Everything the newsroom published, in chronological order. Each item carries origin, sources and reading time.
MARKET Global chip selloff accelerates on China competition and AI capex doubts; SK Hynix down 14.7%, Samsung off 13.4%
BREAKING Diagrid Catalyst 2.0 adds automatic recovery and cryptographic attestation to AI agents
BREAKING Open Secure AI Alliance launches with 35+ companies including Adobe, Microsoft, Salesforce
FUNDING AI-focused seed funding surges to $855M across 150+ rounds in 2026
MARKET Semiconductor stocks plunge on AI spending doubts and China chip advances
FUNDING Dwelly raises $170M for AI property-management rollup strategy
CHIPS NVIDIA deploys Vera CPU across EDA design workflows; Cadence & Synopsys show 1.5x gains
CHIPS Samsung Foundry breaks even: 2nm yields hit 55-60%; Tesla contract signals customers are willing to diversify
BREAKING OpenAI ships Presence: Enterprise agent platform with Codex-driven improvements; resolves 75% of support issues without human handoff
CHIPS NVIDIA Vera Rubin ramps full production; 10x token throughput vs Blackwell, Q3 2026 deployments
CHIPS NVIDIA shelves RTX 50 Super indefinitely; GDDR7 shortage forces gaming GPU cuts for AI demand
RESEARCH Google ships Gemini 3.6 Flash at 17% fewer tokens, $7.50 output price; 3.5 Pro still delayed
RESEARCH Physicists demonstrate reservoir computing with 400 oscillating particles in liquid; F1 0.90 on anomaly detection
FUNDING Anthropic begins IPO investor roadshow; October 2026 Nasdaq debut targeted at $965B–$1T valuation
MARKET Server DRAM prices set to rise 13–18% in Q3 2026 as AI demand outpaces supply; shortage extends into 2027
CHIPS TSMC commits $265B to Arizona, adds advanced packaging; US still ships chips to Taiwan for CoWoS
MARKET Kioxia plunges 16% as memory sector rout spreads; market cap halved in a month
MARKET AI cluster power, not GPUs, is now the bottleneck; grid approval queues hit 24–36 months
CHIPS TSMC Arizona Fab 2 equipment install begins Q3 2026; 3nm production targeted for 2027
CHIPS TSMC A14 progress hits ~90% yield three months ahead of N2 schedule; mass production target 2H 2028
FUNDING Chai Discovery closes $400M Series C at $3.8B; AI antibody design now used by Lilly, Pfizer, Novartis
FUNDING Fireworks AI raises $1.5B Series D at $17.5B; surpasses $1B ARR with 40T+ tokens/day, 95% custom models
BREAKING Neo emerges from stealth with $100M to control agentic AI; Gartner says 40% of enterprise apps will be agentic by EOY
POLICY Hassabis, Nadella, Altman converge on AI regulation; three rival CEOs back independent model review
POLICY FCC expands submarine cable licensing to SLTE; shields U.S. tech giants, blocks Chinese access
BREAKING MCP 2026-07-28 spec removes sessions, adds OAuth hardening; ships July 28 with breaking changes
BREAKING Anthropic launches Claude Opus 5: near-Fable performance at half the price, effort toggle for cost control
MARKET CME launches single-stock futures on 50+ U.S. names including Nvidia, Apple, SpaceX starting July 27
MARKET Alphabet pushes capex to $205B for AI, hits negative free cash flow for first time since IPO
CHIPS CXMT DRAM enters consumer market but undercuts neither Samsung nor SK hynix on price; subsidy effects muted
MARKET Big Tech earnings hit by AI spending concerns; Nasdaq drops 2% as Alphabet, Tesla report cash burn
MARKET Alphabet raises 2026 CapEx guidance to $205B amid AI infrastructure crunch—stock falls despite cloud beat
CHIPS CXMT IPO launches July 27 at $8.6B; Chinese DRAM maker prices above Samsung despite overcapacity fears
CHIPS Zeiss expands Oberkochen site as ASML's EUV bottleneck lingers
POLICY FCC finalizes submarine cable security rules with SLTE licensing and foreign-adversary controls
FUNDING Atoms closes $1.7B funding led by Andreessen Horowitz; Ben Horowitz joins board
BREAKING DeepSeek pauses second fundraising round after viral comments on US-China AI competition
FUNDING Fireworks AI raises $1.5B Series D at $17.5B valuation; enterprise AI inference surpasses $1B ARR
CHIPS Anthropic in early talks to run Claude inference on Microsoft Maia 200 custom silicon via Azure