Broadcom is in talks with lenders including Blackstone and Apollo Global Management to raise more than $60 billion in debt through a special-purpose vehicle (SPV) for an AI chip financing deal benefiting Anthropic and other AI companies. The total financing could reach as much as $100 billion when combined with a roughly $30 billion junior debt tranche, with Broadcom guaranteeing part of the senior-secured portion estimated between $60 billion and $70 billion.
The structure mirrors Broadcom's previous $35 billion AI XPV partnership announced in June with Blackstone and Apollo, which financed computing infrastructure by having an SPV purchase Broadcom chips and lease them to AI customers. Talks are ongoing and details may change, with financing potentially rolled out incrementally rather than all at once.
This unprecedented scale underscores AI infrastructure demand and the capital intensity of the buildout. The financing would help AI firms access chips and computing capacity, following similar mega-deals including Nvidia's $500 billion compute collateralized facility announced earlier this month. For architects, the expansion signals continued hyperscaler-driven chip demand and the increasing reliance on debt financing structures to fund AI capacity buildouts.